JPH0463539B2 - - Google Patents

Info

Publication number
JPH0463539B2
JPH0463539B2 JP59018249A JP1824984A JPH0463539B2 JP H0463539 B2 JPH0463539 B2 JP H0463539B2 JP 59018249 A JP59018249 A JP 59018249A JP 1824984 A JP1824984 A JP 1824984A JP H0463539 B2 JPH0463539 B2 JP H0463539B2
Authority
JP
Japan
Prior art keywords
washing
water
semiconductor material
drying
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59018249A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60163436A (ja
Inventor
Seiichiro Sogo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUROTANI NOBUKO
Original Assignee
KUROTANI NOBUKO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUROTANI NOBUKO filed Critical KUROTANI NOBUKO
Priority to JP1824984A priority Critical patent/JPS60163436A/ja
Publication of JPS60163436A publication Critical patent/JPS60163436A/ja
Publication of JPH0463539B2 publication Critical patent/JPH0463539B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP1824984A 1984-02-06 1984-02-06 半導体材料の洗浄乾燥方法 Granted JPS60163436A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1824984A JPS60163436A (ja) 1984-02-06 1984-02-06 半導体材料の洗浄乾燥方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1824984A JPS60163436A (ja) 1984-02-06 1984-02-06 半導体材料の洗浄乾燥方法

Publications (2)

Publication Number Publication Date
JPS60163436A JPS60163436A (ja) 1985-08-26
JPH0463539B2 true JPH0463539B2 (en]) 1992-10-12

Family

ID=11966402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1824984A Granted JPS60163436A (ja) 1984-02-06 1984-02-06 半導体材料の洗浄乾燥方法

Country Status (1)

Country Link
JP (1) JPS60163436A (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6260027U (en]) * 1985-09-04 1987-04-14
JP2743274B2 (ja) * 1988-07-01 1998-04-22 東京エレクトロン株式会社 基板処理装置および基板搬送装置
JPH0749791Y2 (ja) * 1989-03-28 1995-11-13 沖電気工業株式会社 枚葉式スピン乾燥装置
JPH0648848Y2 (ja) * 1989-08-04 1994-12-12 大日本スクリーン製造株式会社 カセット二連式基板処理装置のカセット整列装置
KR100240022B1 (ko) * 1996-11-21 2000-01-15 윤종용 반도체장치 제조용 현상 장치 및 그의 제어방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4862772U (en]) * 1971-11-16 1973-08-09
JPS5180161A (en]) * 1975-01-09 1976-07-13 Suwa Seikosha Kk
JPS5544780A (en) * 1978-09-27 1980-03-29 Toshiba Corp Cleaning device for semiconductor wafer
JPS5594043U (en]) * 1978-12-21 1980-06-30
JPS5652197U (en]) * 1979-09-27 1981-05-08
JPS57160131A (en) * 1981-03-30 1982-10-02 Hitachi Ltd Washing cell
JPS5994425A (ja) * 1982-11-19 1984-05-31 Nec Kyushu Ltd 半導体製造装置

Also Published As

Publication number Publication date
JPS60163436A (ja) 1985-08-26

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